深圳市富胜新材料有限公司
SHENZHEN FUSION CO.,LTD
13148858866
Product Detail
SIM card,Brank card Hot Melt Adhesive
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Parameters
PART NO.: FS1168
BRAND: FUSION
TYPE: SIM card,Brank card Hot Melt Adhesive
SPECIFICATION: 1480mm
COLOUR: Transparent
Main Raw Material: polyester
Melt Flow Index: 75±25g/10mins
Melting Range: 65-95 ℃
TG Temperature: 8±5℃
Activation Temperature: 116-150℃
Conventional Thickness: 0.055mm
Mechanical Mold Temperature: 140℃-180℃
Single package size:: 0.055mm*29mm*200m
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Smart card, bank card packaging hot melt tape


Smart card, bank card packaging hot melt tape

Description: This product is a thermoplastic film hot melt adhesive, entrusted to release paper, can be repeatedly heated plasticized and bonded. We have high temperature, medium temperature, low temperature three different step temperature packaging tape, and laser bar code heat resistance type and double interface conductive tape. Bonding range: This series is suitable for bonding between various card bases (PVC, PC, ABS) and modules (FR-4, metal).


Application: Bank card, sim card, contact IC card, financial dual interface card, social security dual interface card and other modules and card base packaging.
深圳市富胜新材料有限公司 SHENZHEN FUSION CO.,LTD
TEL/wechat：13148858866 E-MAIL：SALES@SZFUS.COM
Office address: Room 409, Fortune Building, Liuyuelinzhan,                                Longgang District, Shenzhen
Factory Address: Shenghao International Manufacturing                              Park, Shuikou Street, Huicheng District, Huizhou